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High-Speed & Thermal Imaging

Capture what happens too fast to see.

High-speed DIC and synchronized thermal imaging for dynamic events.

1M fps
Peak frame rate
DIC + IR
Synchronized
Full-field
Not point data
ARAMIS
Integrated workflow

The Problem

Strain gauges have bandwidth limits and debond at high strain rates. Milliseconds of crash, impact, and thermal runaway define product safety, and traditional sensors miss them.

The Solution

Three ways Trilion freezes the event

High-Speed DIC

Full-field strain from 1,000 to over 1,000,000 fps, extracted across the entire surface. Not just surviving gauges.

Thermal Coupling

Synchronized IR and DIC on the same surface reveal where heat and strain localize together.

Workflow Support

Trigger setup, data volume management, and batch processing with t.Kit. Same software as your quasi-static tests.

Proven in dynamic labs

“Deployed across crash labs, ballistic ranges, combustion facilities, and battery-abuse programs.”

Integrated with ARAMIS and the full ZEISS ecosystem

Ready to see the event?

Talk to an engineer about your high-speed or thermal testing program.

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Featured Resources

Case studies, white papers, and application notes

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Application Note

High-Speed Infrared Imaging of Crack and Hot-Spot Formation in a Graphite-Fiber and Epoxy Composite Under Dynamic Load

High-speed infrared imaging at 20,000 fps during split-Hopkinson pressure bar experiments on graphite-fiber and epoxy ...

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Guide

Optical 3D Deformation and Strain Measurement (ASNT Nondestructive Testing Handbook, Chapter 10)

Revised ASNT Nondestructive Testing Handbook chapter on 3D image correlation for full-field deformation and strain ...

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Published Paper

Full Field Deformation Measurements During Seismic Loading of Masonry Buildings

This article demonstrates the potential of the Digital Image Correlation (DIC) method to provide accurate full field ...

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Published Paper

3D Image Correlation Studies of Geometry and Material Property Effects During Split Hopkinson Bar Experiments

Full field measurement of strain and strain rate in split Hopkinson bar experiments using the Aramis three-dimensional ...

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Published Paper

Performance Verification of 3D Image Correlation Using Digital High-Speed Cameras

3D image correlation photogrammetry using Phantom v7 digital high-speed cameras is being used extensively to verify and ...

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Key Products & Systems

Purpose-built systems for your application

Measure strain and movement across an entire surface—without contact.

ZEISS ARAMIS Optical Strain

ZEISS ARAMIS Optical Strain uses camera-based Digital Image Correlation (DIC) to measure full-field 3D strain, displacement, and deformation without contact, from material coupons to full-scale structures.

Flagship 3D DIC & Motion Analysis

ARAMIS 3D 12M

Dynamic 3D motion and strain analysis for vibration, impact, and high-speed events at thousands of frames per second.

Market Leader in Ultra High-Speed

Phantom TMX Series

The fastest Phantom cameras ever built. Up to 1.75 million fps at reduced resolution, 76 Gpx/s throughput, and BSI sensor sensitivity for ballistics, fluid dynamics, and fracture mechanics.

Most Flexible Series

Phantom T-Series

T-Series cameras pair multi-megapixel resolution with thousands of frames per second. Ideal for material testing with DIC, automotive crash analysis, and biomechanics motion capture.

From the Blog

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