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Electronics & Tech

Measure microns. Prevent field failures.

Micro-scale full-field strain for solder joints, PCBs, and drop testing.

Micron
Resolution
1000s fps
Drop & shock
DIC + IR
Thermo-mechanical
BGA
Full array capture

The Problem

Strain gauges are too large for solder balls and die surfaces. Failures that start at microns stay invisible until warranty claims roll in.

The Solution

Three ways Trilion de-risks electronics

Solder Joint Reliability

High-mag DIC captures strain across full BGA arrays to predict which joints fail first.

PCB Warpage

Map out-of-plane deformation through reflow to catch head-in-pillow and co-planarity defects.

Drop & Shock

High-speed DIC resolves bending modes and strain waves during millisecond failure events.

Integrated thermo-mechanical

“Synchronized IR + DIC correlates temperature gradients with strain localization on the same surface.”

Built for semiconductor and consumer electronics labs

Ready to find failures earlier?

Talk to an engineer about solder reliability, warpage, or drop testing.

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Featured Resources

Case studies, white papers, and application notes

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Guide

Optical 3D Deformation and Strain Measurement (ASNT Nondestructive Testing Handbook, Chapter 10)

Revised ASNT Nondestructive Testing Handbook chapter on 3D image correlation for full-field deformation and strain ...

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Key Products & Systems

Purpose-built systems for your application

Flagship 3D DIC System

ARAMIS Adjustable

Full-field strain and displacement measurement for components and structures. Scales from coupon to full-scale testing.

Entry-Level 3D Optical Testing

ARAMIS 1

Compact single-sensor DIC for standardized material testing. Tensile, compression, shear, and bend tests.

Compact 3D Scanner

ATOS Q

High-precision structured-light 3D scanner for dimensional inspection, quality control, and reverse engineering.

Handheld Laser Scanner

T-SCAN hawk 2

Wireless handheld laser scanner for rapid 3D capture of large parts and complex geometries in the field.

From the Blog

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