High-Speed DIC for Impact and Crash Testing
In impact, crash, and drop testing, failure can happen in milliseconds. A component may deform, buckle, crack, or abs...
Read More →High-Speed & Thermal Imaging
High-speed DIC and synchronized thermal imaging for dynamic events.
The Problem
Strain gauges have bandwidth limits and debond at high strain rates. Milliseconds of crash, impact, and thermal runaway define product safety, and traditional sensors miss them.
The Solution
Full-field strain from 1,000 to over 1,000,000 fps, extracted across the entire surface. Not just surviving gauges.
Synchronized IR and DIC on the same surface reveal where heat and strain localize together.
Trigger setup, data volume management, and batch processing with t.Kit. Same software as your quasi-static tests.
Proven in dynamic labs
“Deployed across crash labs, ballistic ranges, combustion facilities, and battery-abuse programs.”
Integrated with ARAMIS and the full ZEISS ecosystem
Talk to an engineer about your high-speed or thermal testing program.
Upcoming Events
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View All Events →Featured Resources
High-speed infrared imaging at 20,000 fps during split-Hopkinson pressure bar experiments on graphite-fiber and epoxy ...
Read more →Revised ASNT Nondestructive Testing Handbook chapter on 3D image correlation for full-field deformation and strain ...
Read more →This article demonstrates the potential of the Digital Image Correlation (DIC) method to provide accurate full field ...
Read more →Full field measurement of strain and strain rate in split Hopkinson bar experiments using the Aramis three-dimensional ...
Read more →3D image correlation photogrammetry using Phantom v7 digital high-speed cameras is being used extensively to verify and ...
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Key Products & Systems
Flagship 3D DIC & Motion Analysis
Dynamic 3D motion and strain analysis for vibration, impact, and high-speed events at thousands of frames per second.
Learn more →Ultra high-speed CMOS imaging
The fastest Phantom cameras ever built. Up to 1.75 million fps at reduced resolution, 76 Gpx/s throughput, and BSI sensor sensitivity for ballistics, fluid dynamics, and fracture mechanics.
Learn more →High-resolution high-speed imaging
T-Series cameras pair multi-megapixel resolution with thousands of frames per second. Ideal for material testing with DIC, automotive crash analysis, and biomechanics motion capture.
Learn more →High-speed megapixel imaging
Nova S cameras deliver megapixel resolution at high frame rates with low-light sensitivity. Built for drop tests, impact analysis, and laboratory R&D imaging.
Learn more →
In impact, crash, and drop testing, failure can happen in milliseconds. A component may deform, buckle, crack, or abs...
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If you missed our Webinar: Next-Gen Digital Material Testing: ASTM-Certified Precision, we have yo...
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