Skip to content

Electronics & Semiconductors

See thermal and vibration response, point by point

Full-field strain on populated boards, components, and packages, where strain gages cannot reach every solder joint

Talk to an Engineer

The Problem

Strain gauges are too large for solder balls and die surfaces. Failures that start at microns stay invisible until warranty claims roll in.

The Solution

Three ways Trilion de-risks electronics

Solder Joint Reliability

High-mag DIC captures strain across full BGA arrays to predict which joints fail first.

PCB Warpage

Map out-of-plane deformation through reflow to catch head-in-pillow and co-planarity defects.

Drop & Shock

High-speed DIC resolves bending modes and strain waves during millisecond failure events.

Micron
Resolution
1000s fps
Drop & shock
DIC + IR
Thermo-mechanical
BGA
Full array capture

Applications

ARAMIS DIC strain map overlaid on an integrated circuit showing thermal deformation across the chip surface.
Full-field strain on an integrated circuit, used to validate thermomechanical behavior in electronics packages.
Close-up of a speckle patterned electronics component instrumented for ARAMIS SRX measurement.
A speckle pattern on the heat sink lets ARAMIS SRX track sub-pixel deformation across the part during a vibration or thermal cycle.

Integrated thermo-mechanical

“Synchronized IR + DIC correlates temperature gradients with strain localization on the same surface.”

Built for semiconductor and consumer electronics labs

Ready to find failures earlier?

Talk to an engineer about solder reliability, warpage, or drop testing.

Featured Resources

Case studies, white papers, and application notes

Browse all
Guide

Optical 3D Deformation and Strain Measurement (ASNT Nondestructive Testing Handbook, Chapter 10)

Revised ASNT Nondestructive Testing Handbook chapter on 3D image correlation for full-field deformation and strain ...

Read more →

Key Products & Systems

Purpose-built systems for your application

Measure strain and movement across an entire surface—without contact.

ZEISS ARAMIS Optical Strain

ZEISS ARAMIS Optical Strain uses camera-based Digital Image Correlation (DIC) to measure full-field 3D strain, displacement, and deformation without contact, from material coupons to full-scale structures.

24 megapixel 3D DIC, on any test machine

ARAMIS Adjustable 24M

The high-resolution Adjustable variant for fine-feature strain mapping, large fields of view, and demanding aerospace and battery certification work.

6-DOF drop test automation

t.Drop

Automate drop-test campaigns from fixture setup through 6-DOF motion analysis and reporting. Built for consumer electronics, packaging, and medical device drop programs.

Physical Simulation Systems for Materials Research and Manufacturing

Gleeble Thermo-Mechanical Simulation System

Gleeble's line of thermo-mechanical simulators purpose-built to address the most demanding challenges in materials testing. Whether you're developing next-generation alloys, optimizing manufacturing processes, or validating material performance under extreme conditions, Gleeble's physical simulation systems deliver the precision, repeatability, and control that materials scientists and engineers demand.

From the Blog

View all