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High-Speed & Thermal Imaging

Capture what happens too fast to see.

High-speed DIC and synchronized thermal imaging for dynamic events.

1M fps
Peak frame rate
DIC + IR
Synchronized
Full-field
Not point data
ARAMIS
Integrated workflow

The Problem

Strain gauges have bandwidth limits and debond at high strain rates. Milliseconds of crash, impact, and thermal runaway define product safety — and traditional sensors miss them.

The Solution

Three ways Trilion freezes the event

High-Speed DIC

Full-field strain from 1,000 to over 1,000,000 fps, extracted across the entire surface — not just surviving gauges.

Thermal Coupling

Synchronized IR and DIC on the same surface reveal where heat and strain localize together.

Workflow Support

Trigger setup, data volume management, and batch processing with t.Kit — same software as your quasi-static tests.

Proven in dynamic labs

“Deployed across crash labs, ballistic ranges, combustion facilities, and battery-abuse programs.”

Integrated with ARAMIS and the full ZEISS ecosystem

Ready to see the event?

Talk to an engineer about your high-speed or thermal testing program.

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