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Digital Image Correlation

Full-Field Insight Into How Structures Really Behave

Every structure deforms under load. The question is whether you see it fully or rely on a handful of point measurements and hope nothing critical falls between the gaps.

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ARAMIS 3D Digital Image Correlation system measuring full-field strain

26+ Years of Expertise

The most experienced DIC team in North America

Trilion has specialized in DIC for over 26 years, making us one of the most experienced teams in North America for optical strain measurement. As a ZEISS Certified Partner, we deploy the ARAMIS family of systems, purpose-built for everything from sub-millimeter coupon tests to multi-meter structural assemblies.

Our engineers do not just sell hardware; they work alongside your team to set up, validate, and interpret results so you get defensible data, not just pretty color maps.

The Challenge

Point Sensors Miss Critical Behavior

Strain gauges and extensometers measure at discrete locations. If a crack initiates, a hotspot develops, or load paths shift between those points, you will not see it until failure. DIC captures the full displacement and strain field across the entire specimen or component surface, revealing unexpected concentrations, asymmetries, and failure precursors that point sensors structurally cannot detect.

Full-field DIC strain map on a tensile test specimen revealing deformation that point sensors miss
DIC strain data on shear test specimen for FEA simulation validation

The Challenge

Correlating Simulation with Physical Testing

FEA models predict behavior, but validating those predictions requires measurement data at matching resolution. Point sensors provide sparse comparison points that leave large areas of a model unverified. DIC delivers dense, full-field strain and displacement data that maps directly onto FE meshes, enabling quantitative comparison at thousands of points simultaneously.

The Challenge

Testing Across Scales and Speeds

Real engineering programs span coupon-level material characterization, component fatigue, and full-scale structural proof tests, sometimes at high strain rates. The ARAMIS platform scales from a single-camera 2D setup on a tensile machine to a multi-camera 3D array covering meters of surface area, and supports high-speed acquisition for dynamic and impact events. One ecosystem, consistent data formats, and a single software environment from coupon to structure.

Full-field ARAMIS Optical Strain Adjustable System scaling DIC measurements from coupon to full-scale structural testing

Industries Served

Trusted across demanding industries

Aerospace & Defense Automotive Biomechanics & Medical Civil Engineering Energy Research & Academia Electronics Additive Manufacturing Machinery & Heavy Equipment

See What Full-Field DIC Can Reveal in Your Application

Talk to a specialist about your application. We will show you exactly how DIC fits your testing program.

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Browse DIC Case Studies → Compare with Traditional Methods →